No.031 Many-cores and On-chip Interconnects

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NII Shonan Meeting Seminar 031

Opportunities and Challenges in Inter/Intra-Chip Optical Networks (XU)

The performance and energy efficiency of a multi-core system is determined by not only its processor cores but also how efficiently they collaborate with each other. As new applications continuously require more communication bandwidth, metallic interconnects gradually become the bottlenecks of multi-core systems due to their high power consumption, limited bandwidth, and signal integrity issues. Optical interconnects are promising candidates to bring low power, high bandwidth, and low latency to address inter-chip as well as intra-chip communication challenges. Silicon-based photonic devices, such as optical waveguides and microresonators, have been demonstrated in CMOS-compatible fabrication processes and can be used to build inter/intra-chip optical networks. This talk will discuss the opportunities and challenges of this emerging technology based on our recent findings.

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